STE3500M RF Shielded Test Enclosure

Description

STE3500M RF Shielded Test Enclosure

The STE3500M RF Shielded Test Enclosure provides reliable RF isolation for wireless device testing in laboratory, engineering, and production environments. By creating a controlled RF environment, the enclosure helps reduce external interference and unwanted signal leakage during critical testing operations.

Engineers can use the STE3500M RF Shielded Test Enclosure to test and evaluate RF-enabled devices, including PCBs, wireless modules, components, and fully assembled products. Isolating the device under test (DUT) from surrounding RF signals helps improve measurement consistency and supports repeatable test results.

RF Shielded Test Enclosure for Lab and Production Testing

The STE3500M supports a variety of wireless testing workflows, from product development and validation to manufacturing and production testing. Its shielded design provides a controlled environment where engineers can perform RF measurements without interference from surrounding wireless signals.

The enclosure is suitable for repeated testing and can be incorporated into engineering labs, development environments, and production test stations.

Flexible Configuration and Integration

The STE3500M RF Shielded Test Enclosure can support different test configurations based on application requirements. Available integration options may include RF connections, filtered I/O interfaces, and other connectivity solutions needed to interface with the device under test and external test equipment.

This flexibility allows the STE3500M to accommodate changing test requirements and a variety of RF testing applications.

Reliable RF Isolation for Wireless Device Testing

Consistent RF isolation is essential when testing wireless devices and components. The STE3500M helps create a repeatable test environment by reducing interference from external RF sources while containing signals generated inside the enclosure.

This controlled environment allows engineering and production teams to perform testing more efficiently and obtain more consistent results across multiple test cycles.

Typical Applications

  • Wireless device development and validation
  • RF performance testing
  • PCB and wireless module testing
  • Manufacturing and production testing
  • Engineering and R&D laboratories
  • Automated RF test environments
  • Applications requiring controlled RF isolation

The STE3500M RF Shielded Test Enclosure offers a dependable and flexible solution for engineers and manufacturers requiring controlled RF isolation for wireless device testing, development, validation, and production workflows.

Additional information

Weight 10.43 kg
Dimensions 15.75 × 18.75 × 8.5 in
Function

Manual

Internal Depth

15-20in

Internal Height

6-10in

Internal Width

18in and greater

Manufacturer

Ramsey

Specifications

Key Features

Included Interface Options

None

Included Power

None

Included Ventilation

60MM Honeycomb Vents

I/O Plates Included

2

Loading Style

TOP

Warranty

1 YEAR

Category

BENCH TOP

Absorber/foam

3/4″ INSERTION LOSS

External Dimensions

25.0”(W) X 17.9”(D) X 10.1”(H)

Internal Dimensions

20.2”(W) X 15.2”(D) X 7.7”(H)

Shipping Dimensions

33″(W) X 24″(D) X 15″(H)

Approx. Shipping Weight

40lbs

Shielding Effectiveness (dB)

Isolation At 2.4GHz

>95dB

Isolation At 5.8GHz

>90dB

IO Configurations

Custom Configuration Options

  • RF FEEDTHROUGH: BNC, TNC, SMA, SMB, UHF, Type-N
  • FIBER OPTIC: Fiber optic bulkhead feedthrough, ST, FC
  • DUST COVERS: Dust cover capes with security chains available for all RF feedthrough connectors
  • RF FILTERED DATA: DB9 (10pF), DB9 (100pF), DB9 (1000pF), DB15 (100pF), DB15 (1000pF), DB25 (310pF), DB25 (1000pF), DB37 (310pF), DB37 (1000pF), RJ45/DB9 Filtered, RJ11/DB9 Filtered, USB1/DB9 Filtered
  • POWER CONNECTIONS: 4-Pole filtered barrier strip feed through, 6-Pole filtered barrier strip feed through, internal surge protected power strips (110VAC, 220VAC International)
  • VENTILATION OPTIONS: Dual side mounted RF filtered vents with single filtered exhaust muffin fan, passive vent only
  • RF ABSORBENT FOAM: Standard 1/2″ thick RF absorbent foram liner provides 24dB attenuation. 3/4″ thick foam is standard on the STE3800 and available as an option to provide a flatter response
  • FIBER TRANSCEIVER: Icron Technologies USB 2.0 Fiber Transceiver System available for devices up to 480 MB/s

Note: RF Isolation specs are measured at 1M with terminated RF feedthrough coaxial connectors installed. Actual isolation & attenuation can be affected by adding additional filtered and non-filtered connectors. Check with us for specific connector specifications. STE series I/O interfaces, connectors, and options are frequently updated. Check with us for updates.

I/O InterfaceOrder NumberTypical Data Rate/Line VoltageTypical Shielding*

DB37, 1000pF pi Filter
3409-0012-13 Mbps / 100 VDC,
5 Amps max
>70 dB from 0.5 to 2 GHz
>80 dB from 2 to 3 GHz
>70 dB from 3 to 6 GHz

DB25, 1000pF pi Filter
3409-0009-13 Mbps / 100 VDC,
5 Amps max
>70 dB from 0.5 to 2 GHz
>80 dB from 2 to 3 GHz
>70 dB from 3 to 6 GHz

DB25, 100pF pi Filter
3409-0014-110 Mbps / 100 VDC,
5 Amps max
>50 dB from 0.5 to 2 GHz
>60 dB from 2 to 3 GHz
>60 dB from 3 to 6 GHz

DB9, 1000pF pi Filter
3409-0008-13 Mbps / 100 VDC,
5 Amps max
>70 dB from 0.5 to 2 GHz
>80 dB from 2 to 3 GHz
>70 dB from 3 to 6 GHz

DB9, 100pF pi Filter
3409-0010-110 Mbps / 100 VDC,
5 Amps max
>50 dB from 0.5 to 2 GHz
>60 dB from 2 to 3 GHz
>60 dB from 3 to 6 GHz
STEUSB2071
Max Current: 2A
>80 dB from 741MHz to 6 GHz
STEETHD10G10 Gbps>80dB 100MHz to 40GHz
STEUSB3CCMax Current 3.75A>90 DB 200MHz to 8 GHz
STEUSB312Max Current: 2A>90 DB 200MHz to 8 GHz
STEGBE45911 GBps>90 DB 700MHz to 8 GHz
IEC25010C250 VAC 10A>80 dB at 200 MHz to 30 GHz
STEDC2010100 VDC 10A, 48VAC, 10 A>90 dB 1GHz to 3 GHz