Printed circuit boards (PCBs) are essential in electronic devices, providing both physical support and electrical connections for components like processors, memory, and sensors. During manufacturing, proper testing is crucial to ensure PCBs function correctly and meet required specifications. Several testing methods exist, each with unique benefits and limitations.
In-Circuit Testing (ICT)
One common PCB testing method is in-circuit testing (ICT). This process involves connecting a specialized testing machine to the PCB to check each component and the overall board function. ICT is fast, can be automated, and is ideal for high-volume testing. However, it has limitations, such as difficulty detecting defects related to soldering quality.
Bed-of-Nails and Spring Probes
ICT can be performed using a Bed-of-Nails fixture, a tool designed for simple board-level testing. This setup often includes spring probes, which are specialized electrical connectors that make temporary contact with a PCB’s test points. These probes consist of a spring-loaded metal pin mounted on a carrier, which is then attached to a probe head compatible with the ICT machine.
When the probe head presses onto the PCB, the spring probes establish an electrical connection, allowing for efficient testing. Spring probes are widely used in ICT because they are cost-effective, easy to reconfigure, and adaptable for different PCB designs.